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GOOD NEWS: Welcome ASME Fellow, Prof. Renfu Li  act as Conference Chair and will deliver a speech on ICMAS 2018

The International Conference on Mechanical and Aerospace Systems, ICMAS 2018, will be held in Chengdu, China, from 16^th to 19^th March 2018. ICMAS 2018 is organized by Asia Society of Researchers(ASR) and co-sponsored by Huazhong University of Science and Technology and China University of Geosciences (Wuhan). ICMAS 2018 main objective is to address, explore and exchange information on the state-of-the-art in all types of Mechanical and Aerospace Systems. Will include oral and poster technical sessions for papers describing original and previously unpublished work, plenary sessions with invited speakers, tutorials, and exhibits.

Chengdu, formerly romanized as Chengtu, is the provincial capital of Sichuan province in Southwest China.is also known as the "Country of Heaven" (Chinese: 天府之国; pinyin: Tiānfǔzhiguó), a phrase also often translated as "The Land of Abundance". The discovery of the Jinsha site suggests the area of Chengdu had become the center of the bronze age Sanxingdui culture around the time of the establishment of the state of Shu, prior to its annexation by Qin in 316 BC. It is one of four Imperial cities of Morocco, and the medina of Rabat is listed as a World Heritage site. We also believe that it is a wonderful place to welcome you to this important event.

We are confident that you will enjoy both the technical and social programs, offered to you in the framework of ICMAS 2018 and we look forward to meeting you in Chengdu, China for ICMAS 2018.

2018年机械和航空航天系统国际会议·将于2018年3月16-19日在中国·成都召开。本次会议由亚洲研究者学会主办。本次大会主要围绕机械和航空航天系统研究领域展开讨论，旨在为相关研究方向的专家学者及企业发展人提供一个分享研究成果、讨论存在的问题与挑战、探索前沿科技的国际性合作交流平台。现热忱欢迎从事相关技术研究的专家、学者和专业技术人员踊跃投稿并参加大会。

Paper Publication.

After a careful reviewing process, all accepted papers after proper registration and presentation, will be published in the conference Proceedings. And indexed by EI Compendex, Scopus, Thomson Reuters (WoS), Inspec,et al.

Submit your Full paper / Abstract before: Nov 30, 2017. 

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Keynote speakers

	ASME Fellow, Prof. Renfu Li, Huazhong University of Science and Technology, China
	Prof. Jianxun Jin, University of Electronic Science and Technology of China, China